Fri. May 17th, 2024

Odisha Government Forges Three Key Partnerships for Semiconductor Manufacturing Development

By amfnews Nov 6, 2023 #Featured
Odisha Government Forges Three Key Partnerships for Semiconductor Manufacturing Development_AMF NEWSOdisha Government Forges Three Key Partnerships for Semiconductor Manufacturing Development_AMF NEWS
217 Views

In a significant move to bolster semiconductor manufacturing, the Odisha government has inked three crucial Memoranda of Understanding (MoUs) with prominent entities. These agreements aim to establish a thriving ecosystem for semiconductor production and associated sectors in the state.

The government’s first partnership was formed with the India Electronic and Semiconductor Association (IESA). Under this MoU, IESA will play a pivotal role in supporting the Odisha government’s efforts to enhance capacity-building programs and foster the semiconductor ecosystem. IESA will also be actively involved in organizing events and developing knowledge materials to further advance this vital sector.

The second MoU was signed with Synopsys, a global semiconductor giant. This collaboration will encompass a wide range of initiatives, including the O-Chip program, talent transformation, workforce development, readiness assessments in semiconductor and very large-scale integration (VLSI) domains, and providing internship and placement support to engineering students in Odisha. The partnership with Synopsys is poised to drive innovation and skill development in the semiconductor industry.

The third MoU was established with the Electronics and Computer Software Export Promotion Council (ESC), with the goal of promoting electronics and IT/ITeS exports from the country. This initiative will further strengthen Odisha’s foothold in the rapidly evolving technology landscape.

These agreements come on the heels of the successful hosting of Odisha4Silicon-2023, an pioneering initiative aimed at cultivating a robust semiconductor ecosystem in the region. The event also marked the launch of the pan-India Design Challenge under O-Chip, organized by Electropreneur Park, Bhubaneswar. Alongside the MoUs, other noteworthy initiatives were introduced, including the formation of the IESA Odisha Chapter and the Campus Connect Programme, designed to foster innovation, skill development, and industry-academia collaborations within the state.

Odisha’s Electronics and IT Minister, TK Behera, emphasized that the state has notified its ‘Semiconductor Manufacturing and Fabless Policy 2023,’ offering an attractive package of incentives to investors. Additionally, Odisha has launched the Odisha Semiconductor Fab and Fabless Innovation and Acceleration Programme (O-Chip), aimed at catalyzing the development of a thriving semiconductor ecosystem within the state.

Speaking at the event, Chief Minister Naveen Patnaik underlined the transformative potential of Odisha4Silicon-2023, which is poised to create a vibrant semiconductor ecosystem, drive innovation, spur economic growth, and generate employment opportunities for the state’s residents. This strategic push towards semiconductor manufacturing aligns with Odisha’s vision of becoming a hub for research and development in this pivotal sector.

By amfnews

Related Post